Name: Panasonic EX-11EB Ultra-Slim Through-Beam Photoelectric Sensor - INOSAKI
SKU: Pananonic-EX-11EB
Price: 36.48 USD
Availability: InStock

Technical Overview

Ultra-slim (0.35cm thick), side-sensing through-beam sensor with 150mm range, 0.5ms NPN Dark-ON output, and IP67 rating for precise small object detection.

Key Features

Ultra-slim design with a thickness of only 3.5 mm.
Through-beam sensing mode with a 150 mm detection range.
NPN open-collector output with Dark-ON operation.
High-speed response time of 0.5 ms or less.
IP67 protection rating ensures resistance to dust and water.
Capable of detecting minimum opaque objects of ø1.0 mm.
Utilizes a Red LED light source (680 nm peak wavelength) for easy beam alignment.
Wide supply voltage range of 12 to 24 VDC (±10%).
High repeatability of 0.05 mm or less for consistent performance.
Compliant with CE, UKCA, ISO 13849-1 (Category 1, PLc), and UL Recognition certifications.

Technical Specification Matrix

Parameter	Value
Sensing Method	Through-Beam
Sensing Range	150 mm
Minimum Detectable Object	ø1.0 mm opaque object
Supply Voltage	12 to 24 VDC (±10% Ripple P-P 10% or less)
Output Type	NPN Open Collector Transistor
Maximum Sink Current	50 mA
Applied Voltage (Output)	30 V DC or less
Residual Voltage (at 50mA sink)	2 V or less
Operation Mode	Dark-ON
Response Time	0.5 ms or less
Repeatability (perpendicular to sensing axis)	0.05 mm or less
Light Source	Red LED (Peak emission wavelength: 680 nm)
Connection Type	2 m pre-wired cable (3-core receiver, 2-core emitter)
IP Rating	IP67
Operating Temperature	-25 to +55 °C
Storage Temperature	-30 to +70 °C
Ambient Humidity	35 to 85 % RH (no condensation)
Enclosure Material	Polyarylate (also cited as Polyethylene terephthalate)
Lens Material	Polyarylate
Physical Weight (kg)	0.02
Dimensions L x W x H (cm)	2.05 x 1 x 0.35

Industrial Applications

1. Robotic Arm Component Alignment

The EX-11EB's ultra-slim profile and 0.05 mm repeatability allow for precise detection and alignment of small electronic components (e.g., PCBs, connectors) within the confined work envelope of robotic arms on automated assembly lines. Its through-beam sensing ensures reliable presence detection, critical for accurate pick-and-place operations.

Problem Solved

Ensures accurate and repeatable placement of small components by providing high-precision presence and position feedback, preventing assembly errors and improving throughput in confined robotic work environments.

Robotic assemblypick-and-placecomponent detectionprecision positioningminiature sensor0.05mm repeatability3.5mm thickness

2. High-Speed Small Part Counting

Ideal for production lines handling small items like pharmaceutical tablets or electronic pins, the EX-11EB detects objects as small as ø1.0 mm with a rapid 0.5 ms response time. Its through-beam mode reliably counts items, even transparent ones, while the IP67 rating ensures durability in environments with dust or potential washdowns.

Problem Solved

Accurately counts small, fast-moving items on a production line, preventing under- or over-packaging and ensuring precise inventory management without slowing down the manufacturing process.

Object countinghigh-speed detectionminiature object detectionø1.0mm minimum object0.5ms responseIP67production monitoring

3. Semiconductor Wafer Edge Detection

In semiconductor manufacturing, the ultra-slim design (3.5 mm) and 0.05 mm repeatability of the EX-11EB enable precise edge detection of thin silicon wafers in carriers or during robotic transfer. This critical feedback, combined with its fast response, ensures accurate control of wafer movement, preventing damage during handling.

Problem Solved

Provides highly accurate and rapid edge detection for thin and fragile semiconductor wafers, enabling precise control of robotic handling systems and preventing costly damage during automated processing.

Wafer handlingsemiconductor manufacturingedge detectionultra-slim sensorhigh repeatabilityprecision control3.5mm thickness