Omron E3T-FT21 2M Ultra-Compact Through-Beam Photoelectric Sensor

USD 54.29

Miniature 300mm through-beam sensor. NPN Light-ON, IP67-rated, and 2m cable. Compact side-view design ideal for semiconductor wafer mapping and precision part presence verification.

SKU Omron-E3T-FT21 2M Category
Photoelectric Sensor

Omron E3T-FT21 2M Ultra-Compact Through-Beam Photoelectric Sensor

Model Identifier E3T-FT21 2M
Official Part Number E3T-FT21 2M
GTIN Standard NA

Technical Overview

The Omron E3T-FT21 2M is an ultra-compact, flat-view through-beam photoelectric sensor engineered for precision detection in space-constrained industrial environments. Featuring a miniature flat-shape housing that is just 3.5 mm thick, it utilizes a highly visible Red LED (650 nm) light source capable of detecting small opaque objects down to 1.3 mm in diameter across a 300 mm sensing range. The sensor operates on a 12 to 24 VDC power supply and outputs an NPN Light-ON signal with a fast 1 ms maximum response time. It is built with a rugged thermoplastic P.B.T. polymer housing that meets IP67 protection standards, ensuring reliability against dust and water ingress. Pre-wired with a 2-meter cable and designed for easy M2 screw mounting, this sensor is ideal for electronics assembly, semiconductor manufacturing, and tight machinery integration.

Key Features

  • Ultra-thin flat-shape design (19 x 12 x 3.5 mm) for integration in tight spaces
  • Through-beam sensing method with a 300 mm detection distance
  • Red LED light source (650 nm) for pinpoint precision and easy alignment
  • Detects small opaque objects as small as 1.3 mm in diameter
  • Fast 1 ms maximum response time for high-speed automated processes
  • NPN Light-ON digital output (26.4 VDC max, 50 mA max)
  • High EMC and ambient light immunity (incandescent: 5,000 lx max, sunlight: 10,000 lx max)
  • IP67 degree of protection with robust thermoplastic polymer housing
  • Pre-wired with a 2-meter cable for direct and flexible connection

12 to 24 VDC ±10% supply voltage; Total current consumption 30 mA max (10 mA Emitter, 20 mA Receiver).

Technical Specification Matrix

ParameterValue
Supply Voltage12 to 24 VDC ±10%
Sensing MethodThrough-beam
Sensing Distance300 mm
Output TypeNPN (Light-ON)
Light SourceRed LED (650 nm)
Response Time1 ms max. (operate or reset)
Current ConsumptionEmitter: 10 mA max., Receiver: 20 mA max.
Minimum Detectable ObjectOpaque: 1.3 mm dia. min.
Degree of ProtectionIP67
Connection MethodPre-wired, 2 m cable
Ambient Operating Temperature-25 to +55 °C
MountingSurface with through-holes (M2 screw)

Industrial Applications

1. Micro-Electronic Component Detection in Pick-and-Place Machines

In high-density printed circuit board (PCB) assembly lines, confirming the presence and proper alignment of miniature electronic components is critical before soldering. The E3T-FT21 fits effortlessly into exceedingly narrow robotic head spaces thanks to its 3.5 mm thick profile. It uses a precision Red LED to detect components as small as 1.3 mm, ensuring precise high-speed automation.

Problem Solved

Overcomes the physical footprint limitations of standard sensors on miniaturized component indexers, successfully preventing skipped placements without interfering with the mechanical motion.

Through-beam1.3 mm opaque object3.5 mm flat housingNPN output1 ms response time

2. High-Speed Laboratory Vial Transfer Verification

Diagnostic medical equipment that rapidly handles small test tubes or vials requires reliable presence detection as samples move between testing stations. The 300 mm sensing range combined with the fast 1 ms response time allows the sensor to reliably monitor carousels and indexers, while the IP67 housing protects against minor spills or washdown environments.

Problem Solved

Eliminates false negatives or missed reads in high-speed, small-vial handling systems by utilizing an ultra-fast beam break detection resistant to ambient diagnostic lighting.

IP67 rating300 mm sensing distance650 nm Red LED1 ms response timeAmbient light immunity

3. Semiconductor Wafer Cassette Mapping

Monitoring thin semiconductor wafers inside loading cassettes requires sensors that can detect extremely thin profiles while mounted inside tight transport machinery. The ultra-compact dimensions and simple M2 through-hole mounting enable these sensors to be embedded directly into robotic end-effectors or cassette nests to verify wafer presence.

Problem Solved

Provides dependable opaque object detection in ultra-tight clearances where bulky photoelectric sensors would physically clash with semiconductor transfer robots.

Ultra-compactM2 screw mountingThermoplastic P.B.T.12-24 VDCLight-ON
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