1. Wafer Tray Position Verification
Ensures proper placement and alignment of semiconductor wafers in tight robotic transfer environments.
Problem SolvedSpace constraints in wafer handling robots often preclude standard sensors; the ultracompact flat-form profile securely monitors proximity (5-30 mm) without physical contact, averting wafer damage.
Semiconductor fabricationWafer mappingDiffuse-reflectiveUltracompact photoelectric
2. Blister Pack Jam Detection
Monitors the tight conveyor transition zones in high-speed pharmaceutical packaging lines for jammed blister packs.
Problem SolvedUnnoticed jams damage machinery; the 1 ms high-speed response and Dark-ON trigger rapidly detect blockages against a background, while the IP67 housing resists periodic washdowns.
Jam detectionIP67 enclosure1 ms responsePharmaceutical packaging
3. Micro-Assembly Robotic Gripper Sensing
Verifies the presence of miniature components in the jaws of micro-assembly robotic end-effectors.
Problem SolvedPayload and spatial restrictions on robot arms limit sensor sizes; the lightweight footprint (~20g) and flexible 2m flying lead cable integrate seamlessly into gripper mechanisms for reliable pick-up confirmation.
Robotic end-effectorMicro-assemblyNPN outputFlat-form sensor