$ 585.00
High-speed de-ionizing bar featuring tungsten electrode cartridges and a 400mm length. Includes a 3m power cable and 6mm one-touch fittings for static control.
The SMC IZS40-400-06B is a precision 400mm bar-type ionizer from the IZS40 standard series, engineered for rapid static elimination in industrial automation environments. This unit integrates a high-voltage power supply directly into the bar body, requiring only a low-voltage 24 VDC input, thereby eliminating the need for bulky external high-voltage cabling. The configuration includes a 3-meter power supply cable (06) and end mounting brackets (B). It is designed to house 6 de-ionizing cartridges (High Speed Tungsten type standard), utilizing corona discharge to neutralize static charges on workpieces from a distance. The system features an auto-balance sensor to maintain ion balance within ±30V, minimizing maintenance requirements. Operates with Clean Dry Air (CDA) to create an air curtain effect that assists ion transport and prevents emitter contamination.
| Technical Parameter | Specification |
|---|---|
| Series | IZS40 (Standard Type) |
| Bar Length | 400 mm |
| Ion Generation Method | Corona Discharge (DC) |
| Applied Voltage | ±7,000 V |
| Ion Balance | ±30 V |
| Number of Cartridges | 6 |
| Included Cable Length | 3 m |
| Fluid Type | Clean Dry Air (CDA) |
| Supply Pressure Range | 0.1 to 0.5 MPa |
| Air Consumption (Total) | ~158.4 L/min (ANR) @ 0.5 MPa |
| Input Voltage | 24 VDC ±10% |
| Current Consumption | 330 mA or less |
| Tube Connection OD | ø6 mm |
| Operating Temperature | 0 to 40°C |
| Material (Body) | ABS / Stainless Steel |
| Material (Emitters) | Tungsten (Standard) |
| Body Dimensions (HxW) | 38 mm x 30 mm (Excluding cartridges/bracket) |
| Weight | 0.764 kg (Approx. total with cable/brackets) |
Neutralizes large surface area glass substrates during conveyor transfer and separation from surface plates.
Prevents electrostatic discharge (ESD) that causes glass breakage or circuit damage, and eliminates static attraction of dust particles.
Eliminates static buildup on printed circuit boards during dicing, component mounting, and testing processes.
Mitigates ESD risks to sensitive semiconductor components and prevents mounting errors due to static latching.
Removes static charge from resin or rubber molded parts immediately upon mold opening to facilitate release.
Reduces cycle times by ensuring smooth detachment from the die and prevents airborne dust from adhering to the fresh part.
