Basler ace 2 a2A4504-5gcBAS Color GigE Camera

Technical Overview

20.2 MP color GigE camera with Sony IMX541 global shutter sensor, 5 fps, and IP30 rating for industrial use.

Key Features

Sony IMX541 CMOS Global Shutter Sensor.
20.2 MP resolution (4504 x 4504 pixels).
5 fps frame rate.
GigE interface for reliable data transfer.
Power over Ethernet (PoE) or 12-24 VDC power supply.
C-mount lens compatibility.
1 opto-coupled input and 2 general purpose I/O lines.
IP30 protection class.
Compact housing (29 x 29 mm footprint).
Compliant with GenICam and GigE Vision standards, supported by Basler pylon Software Suite.
Removable IR cut filter.

Technical Specification Matrix

Parameter	Value
Resolution (H x V Pixels)	4504 x 4504 (default resolution)
Resolution	20.2 MP
Sensor Type	Sony IMX541 Progressive scan CMOS Global shutter
Sensor Format	1.1"
Pixel Size (H x V)	2.74 x 2.74 µm
Frame Rate (at Default Settings)	5.0 fps
Image Data Interface	Gigabit Ethernet (1000 Mbit/s)
Power Supply	PoE (IEEE 802.3af) or 12–24 VDC via I/O connector
Power Consumption (typical)	≈4.6 W (PoE) / ≈3.2 W (12–24 VDC)
I/O Lines	1 opto-coupled input, 2 general purpose I/O (GPIO) lines
Lens Mount	C-mount
Protection Class	IP30
Operating Temperature	-10 °C to 60 °C
Conformity	CE (incl. RoHS), EAC, UKCA, UL Listed, FCC, KC, GenICam, GigE Vision, IEEE 802.3af (PoE)
Pixel Bit Depth	8 bits; 10 bits; 12 bits
Physical Weight (kg)	0.1
Dimensions L x W x H (cm)	4.89 x 2.9 x 2.9

Industrial Applications

1. High-Resolution PCB Inspection in Electronics Manufacturing

This camera is ideal for Automated Optical Inspection (AOI) systems on Printed Circuit Boards (PCBs). Its 20.2 MP resolution (4504 x 4504 pixels) enables the precise detection of microscopic defects such as misalignments, solder shorts, or missing components. The global shutter ensures clear images of fast-moving PCBs, making it crucial for maintaining high quality in electronics production.

Problem Solved

Automates the identification of minute defects on PCBs, enhancing product quality and reliability beyond manual inspection capabilities and preventing costly failures in electronic devices.

Automated Optical Inspection (AOI)Printed Circuit Board (PCB)defect detection20.2 MPglobal shutterelectronics manufacturing

2. Precision Dimensional Verification in Automotive Assembly

The camera's high resolution and global shutter capability make it suitable for non-contact precision measurement and gauging of automotive components. It can capture detailed images for verifying critical dimensions and assembly accuracy with sub-micron precision (2.74 µm pixel size), even on high-speed production lines. The GigE interface with PoE simplifies system integration.

Problem Solved

Ensures the exact dimensional accuracy and correct assembly of automotive parts, significantly reducing manufacturing errors and enhancing vehicle safety and performance.

Dimensional gaugingprecision measurementautomotive manufacturingglobal shutterGigE2.74 µm pixel size

3. Secure Pharmaceutical Packaging and Label Verification

Utilizing its high resolution and color imaging, this camera can perform stringent quality checks on pharmaceutical packaging and labels. It accurately reads small text, verifies barcodes, and inspects color and print quality at 5 frames per second. The IP30 rating provides necessary protection for use within controlled pharmaceutical production environments.

Problem Solved

Guards against mislabeled or incorrectly packaged pharmaceutical products, thereby safeguarding patient health and ensuring adherence to stringent regulatory standards.

Pharmaceutical inspectionlabel verificationbarcode readingprint qualitycolor inspection20.2 MP