1. Robotic Arm Component Alignment
The EX-11EB's ultra-slim profile and 0.05 mm repeatability allow for precise detection and alignment of small electronic components (e.g., PCBs, connectors) within the confined work envelope of robotic arms on automated assembly lines. Its through-beam sensing ensures reliable presence detection, critical for accurate pick-and-place operations.
Problem SolvedEnsures accurate and repeatable placement of small components by providing high-precision presence and position feedback, preventing assembly errors and improving throughput in confined robotic work environments.
Robotic assemblypick-and-placecomponent detectionprecision positioningminiature sensor0.05mm repeatability3.5mm thickness
2. High-Speed Small Part Counting
Ideal for production lines handling small items like pharmaceutical tablets or electronic pins, the EX-11EB detects objects as small as ø1.0 mm with a rapid 0.5 ms response time. Its through-beam mode reliably counts items, even transparent ones, while the IP67 rating ensures durability in environments with dust or potential washdowns.
Problem SolvedAccurately counts small, fast-moving items on a production line, preventing under- or over-packaging and ensuring precise inventory management without slowing down the manufacturing process.
Object countinghigh-speed detectionminiature object detectionø1.0mm minimum object0.5ms responseIP67production monitoring
3. Semiconductor Wafer Edge Detection
In semiconductor manufacturing, the ultra-slim design (3.5 mm) and 0.05 mm repeatability of the EX-11EB enable precise edge detection of thin silicon wafers in carriers or during robotic transfer. This critical feedback, combined with its fast response, ensures accurate control of wafer movement, preventing damage during handling.
Problem SolvedProvides highly accurate and rapid edge detection for thin and fragile semiconductor wafers, enabling precise control of robotic handling systems and preventing costly damage during automated processing.
Wafer handlingsemiconductor manufacturingedge detectionultra-slim sensorhigh repeatabilityprecision control3.5mm thickness
