Technical Overview

Ultra-slim 3.5mm thick front-sensing thru-beam NPN photoelectric sensor with 150mm range, 0.5ms response, and IP67 rating for compact, high-speed detection.

Key Features

Ultra-slim body: 10 mm (W) × 14.5 mm (H) × 3.5 mm (D)
Front sensing type
Through-beam sensing mode
NPN open-collector output
150 mm sensing range
Light-ON operation mode
High-speed response time of 0.5 ms or less
IP67 protection rating
Red LED light source (680 nm peak emission wavelength)
Minimum detectable object: ø1 mm opaque object
Wide operating voltage: 12-24 VDC ±10%
Mountable with M3 screws
2-meter pre-wired cable connection

Technical Specification Matrix

Parameter	Value
Series	EX-10 Series
Sensing Mode	Through-beam
Sensing Range	150 mm
Minimum Detectable Object	ø1 mm opaque object
Output Type	NPN Open-Collector Transistor
Max. Sink Current	50 mA
Applied Output Voltage	30 V DC or less
Residual Output Voltage	2 V or less (at 50 mA), 1 V or less (at 16 mA)
Supply Voltage	12 to 24 V DC ±10% (Ripple P-P 10% or less)
Current Consumption	Emitter: 10 mA or less, Receiver: 10 mA or less
Response Time	0.5 ms or less
Light Source	Red LED (Peak emission wavelength: 680 nm)
Operation Mode	Light-ON
Protection Rating	IP67 (IEC)
Operating Temperature	-25 to +55 °C
Storage Temperature	-30 to +70 °C
Ambient Humidity	35 to 85 % RH (no dew condensation or icing)
Enclosure Material	Polyethylene terephthalate
Lens Material	Polyalylate
Cable Length	2 m
Physical Weight (kg)	0.06
Dimensions L x W x H (cm)	0.35 x 1 x 1.45

Industrial Applications

1. Precision Part Detection in Automated Assembly

The EX-11A can precisely detect the presence or absence of small components, such as micro-switches or electronic parts, on a fast-moving conveyor belt or within a robotic pick-and-place operation.

Problem Solved

Its ultra-slim profile (3.5mm thick) and 150mm range allow it to fit into confined spaces, ensuring accurate and high-speed detection of small objects (ø1mm min.) critical for quality control and preventing assembly errors. The 0.5ms response time keeps pace with high-speed production lines.

Micro-assemblyobject detectionquality controlhigh-speed automationcompact machinerysmall part verification

2. Wafer Cassette Positioning in Semiconductor Manufacturing

In semiconductor fabrication, the EX-11A is suitable for precise positioning and detection of thin wafer cassettes or individual wafers within a processing tool, leveraging its compact size and fine object detection capabilities.

Problem Solved

The sensor's slim form factor (3.5mm thick) integrates into wafer handling robots or process chambers without interference. The 150mm range provides reliable detection across small gaps for correct placement, preventing costly damage. Its IP67 rating ensures resilience in cleanroom environments with specific cleaning procedures.

Semiconductorwafer handlingcleanroomprecision positioningcassette detectionprocess automation

3. Tool Breakage Detection in CNC Machines

Mounted near the cutting tool in a CNC machine, the EX-11A can immediately detect if a small drill bit or milling cutter (with a minimum diameter of ø1mm) has broken during operation.

Problem Solved

The compact size allows close mounting to the tool, minimizing interference. Its fast 0.5ms response time can trigger an immediate machine stop upon tool breakage, preventing damage to the workpiece and machine, and enhancing safety. The IP67 rating protects the sensor from coolant and debris in harsh machining environments.

CNC machiningtool monitoringbreakage detectionindustrial safetyhigh-speed processingharsh environment

Panasonic EX-11A Ultra-Slim Thru-Beam Photoelectric Sensor

Panasonic EX-11A Ultra-Slim Thru-Beam Photoelectric Sensor

Technical Overview

Key Features

Technical Specification Matrix

Industrial Applications

1. Precision Part Detection in Automated Assembly

2. Wafer Cassette Positioning in Semiconductor Manufacturing

3. Tool Breakage Detection in CNC Machines