1. Silicon Wafer Tilt and Height Positioning
Directing a Class 1 laser onto highly reflective silicon wafers to determine exact height and tilt before robotic wafer-handling processes.
Problem SolvedSilicon wafers used in semiconductor manufacturing have mirror-like finishes that cause standard diffuse sensors to experience massive light dispersion. The specular reflection optical layout of the HL-G108A-RS-J captures direct specularly reflected light from mirror surfaces, enabling a precise 2.5 µm resolution height profile without harming the surface.
silicon waferspecular reflectionsemiconductor processingZ-axis positioningClass 1 laser
2. Glass Panel Thickness and Flatness Verification
Continuous non-contact measurement of flat panel display (FPD) glass substrates on high-speed conveyor lines.
Problem SolvedTransparent glass panel substrates reflect light poorly when using diffuse laser sensors, as light passes straight through. This sensor's specialized specular alignment captures reflection off the front polished surface, leveraging the ±10 mm range to detect thickness variations, warp, or sag in the glass substrate during automated transport.
FPD glass substrateglass thicknessflatness verificationspecular alignmentdisplacement sensor
3. High-Speed HDD Platter Runout Monitoring
Real-time verification of mirror-finished hard disk drive (HDD) platters during spin testing to evaluate axial runout and rotational eccentricity.
Problem SolvedExtremely reflective HDD platters rotate at thousands of RPM, requiring high-frequency feedback and zero toleration for reflection scattering. A 200 μs sampling cycle paired with RS-485 serial communication allows this sensor to feed rapid distance measurements to a host controller, flagging minimal axial wobbles in real-time.
axial runoutHDD plattereccentricityRS-485 communication200 μs sampling
