1. Semiconductor Bond Wire Presence Verification
Checking for the presence of micro-wires (such as gold or copper bonding wires) in high-density semiconductor packaging processes [1.3.1].
Problem SolvedStandard photoelectric sensors fail to detect thin wires because their beam spots are too large. The EX-L261-P utilizes an ultra-fine red laser spot capable of resolving targets down to a ø0.01 mm gold wire, ensuring accurate detection without bulky external amplifiers.
Class 1 Laser0.01 mm ResolutionGold Wire DetectionSemiconductor PackagingPBT Enclosure
2. IC Lead Frame Seating Verification
Verifying that integrated circuits (ICs) are perfectly flush and correctly nested inside carrier lead frames on automated conveyor systems.
Problem SolvedStructural machine vibration and shiny metal backgrounds typically cause standard reflective sensors to register false positives. Because the EX-L261-P is a convergent sensor, its active detection zone is strictly limited to 20–50 mm, meaning background machinery beyond 50 mm is completely ignored. Its 0.5 ms response rate allows seamless error detection at high line speeds.
Convergent ReflectiveBackground Suppression0.5 ms Response TimeIC Carrier AssemblyPNP Output
3. Pharmaceutical Blister Pack Fill Inspection
Detecting the exact seating or presence of translucent gel-caps or glossy foil tabs on pharmaceutical packaging machines.
Problem SolvedTransparent plastics and mirror-like metallic foils often cause reflection errors or fail to return enough light. The EX-L261-P's convergent optics are specifically designed to handle transparent, translucent, or unevenly colored workpieces. Meanwhile, its IP67 housing protects it against routine pharmaceutical washdowns.
Transparent Target DetectionIP67 RatingConvergent Point 22mmBlister PackagingSensitivity Potentiometer
