USD 1,199.00
This 2MP telecentric C-mount lens offers 1.0x magnification, a 111.5mm working distance, and -0.003% distortion for precise optical inspection.
This 2MP telecentric C-mount lens offers 1.0x magnification, a 111.5mm working distance, and -0.003% distortion for precise optical inspection.
| Parameter | Value |
|---|---|
| Mount | C-Mount [1.5] |
| Max Image Format | 2/3" (φ11mm) |
| Magnification | 1.0X |
| Working Distance | 111.5mm |
| Effective F Number | 10.1 |
| Depth of Field | 0.82mm |
| Resolving Power | 6.9μm |
| TV Distortion (2/3 type) | -0.003% |
| Back Focal Length | 17.0mm |
| Flange Back Length | 17.526mm |
| Operating Temperature | -10°C to +50°C |
| Physical Weight (kg) | 0.11 |
| Dimensions L x W x H (cm) | 12.67 x 3 x 3 |
Verifyinghigh-densityPCBcomponentsusingthe1.0xmagnificationandtelecentricopticstomaintainabsolutemeasurementintegrityacrossthesensorfield[1.1].
Perspective errors in standard entocentric lenses cause false dimension failures on flat components. Telecentricity solves this by eliminating parallax.
Inspecting tight-tolerance micro-machined parts from exactly 111.5mm away, ensuring precise sub-millimeter measurements with -0.003% distortion.
Standard lenses shift apparent object dimensions if part depth slightly varies on the inspection line, ruining exact metrology measurements.
Providing consistent, high-contrast imaging of fiducial markers on silicon wafers by leveraging the 0.82mm depth of field and 6.9μm resolving power.
Tiny Z-axis height fluctuations during wafer positioning can defocus alignment markers or shift their apparent X/Y coordinates in conventional lenses.
