1. High-Speed Robotic Pick-and-Place
Utilized on robotic automation arms to securely grip and rapidly release small to medium-sized components on fast-moving assembly lines.
Problem SolvedEliminates workpiece sticking during release phases by utilizing the integrated ejector pulse, drastically increasing machine cycle rates.
Ejector PulseHigh VacuumLaval Nozzle 0.95mmPick-and-Place
2. Electronics Component Packaging
Integrated directly into CPV14 manifolds to provide centralized, precise vacuum control for handling delicate PCBs and semiconductor packaging.
Problem SolvedProvides a reliable 85% vacuum without introducing excessive mechanical vibration or localized heat, ensuring the safe lifting of fragile electronic components.
Vacuum Generator85% Max VacuumDie-cast AluminumCPV14 Manifold
3. Automated End-of-Line Packaging
Deploys suction cups connected via G1/8 ports to pull flat cardboard blanks from magazines, erecting them into boxes for final packaging.
Problem SolvedEnsures strong gripping force across varying line pressures (up to 10 bar), allowing the reliable manipulation of porous and heavy cardboard materials.
2 to 10 bar PressureG1/8 Vacuum PortSub-base Pneumatic Connection