IDS NXT malibu Experience Kit 12 Monate Industrial Camera

Technical Overview

Features an 8 MP Sony IMX678-AAQR1-C CMOS color sensor, 3840x2160 resolution, 27 fps, C-Mount, GigE, IP30 aluminum housing, and 12-24V DC/PoE+ power.

Key Features

8 MP CMOS Color Sensor (Sony IMX678-AAQR1-C)
3840 x 2160 Pixel Resolution (8.29 Mpix)
27 fps Freerun Mode / 10 fps Trigger Mode
GigE RJ45 and 8-pin Hirose I/O connectivity
C-Mount lens interface
IP30 rated aluminum housing
12 V - 24 V DC or Power over Ethernet (PoE+)
Operating temperature range: 0 °C to 55 °C
On-camera image pre-processing features (Auto exposure, gain, whitebalance, BayerGR8 pixel format)
Hardware and software trigger capabilities

Technical Specification Matrix

Parameter	Value
Sensor type	CMOS Color
Shutter	Rolling shutter
Sensor characteristic	Linear
Pixel Class	8 MP
Resolution	8.29 Mpix
Resolution (h x v)	3840 x 2160 Pixel
Aspect ratio	16:9
ADC	12 bit
Color depth (camera)	8 bit
Optical sensor class	1/1.8"
Optical Size	7.680 mm x 4.320 mm
Optical sensor diagonal	8.81 mm 1/1.8"
Pixel size	2 µm
CRA (Chief Ray Angle)	0°
Sensor Manufacturer	Sony
Sensor Model	IMX678-AAQR1-C
Frame rate freerun mode	27 fps
Frame rate trigger (continuous)	10 fps
Frame rate trigger (maximum)	10 fps
Exposure time (minimum - maximum)	0.031 ms - 33.333 ms
Power consumption	6 W - 7 W
Image memory	72 MB
Allowed device temperature during operation	0 °C - 55 °C / 32 °F - 131 °F
Allowed ambient temperature during storage	-20 °C - 60 °C / -4 °F - 140 °F
Humidity (relative, non-condensing)	20% - 80%
Interface connector	GigE RJ45, screwable
I/O connector	8-pin Hirose connector (HR25-7TR-8PA(73))
Power supply	12 V - 24 V or PoE+
Lens Mount	C-Mount
IP code	IP30
Dimensions H/W/L	34.0 mm x 44.0 mm x 73.0 mm
Housing material	Aluminum
Physical Weight (kg)	0.16
Dimensions L x W x H (cm)	7.3 x 4.4 x 3.4

Industrial Applications

1. High-Precision Quality Control for Electronics Manufacturing

In surface-mount technology (SMT) production lines, the IDS NXT malibu's 8 MP sensor and 2 µm pixel size enable ultra-fine inspection of component placement, solder joint integrity, and detection of minuscule defects on printed circuit boards (PCBs). Its high resolution is critical for identifying misaligned components or bridging on dense boards.

Problem Solved

Ensures zero-defect output in micro-electronics assembly by precisely verifying component presence, orientation, and solder quality, preventing costly rework or field failures.

SMT inspectionPCB quality controlsolder joint analysisdefect detectionmicro-electronics

2. Automated Optical Inspection (AOI) in Pharmaceutical Packaging

The camera's 3840 x 2160 pixel resolution and rapid 27 fps freerun mode are ideal for high-throughput inspection of pharmaceutical packaging, verifying label accuracy, batch code legibility, and seal integrity. Its color CMOS sensor can distinguish subtle color variations in labels or product attributes.

Problem Solved

Guarantees compliance and safety in drug packaging by automating the verification of critical information and physical integrity, minimizing human error in fast-paced production environments.

Pharmaceutical packaginglabel inspectionbatch code verificationseal integrityhigh-throughput AOI

3. Robotic Guidance and Bin Picking for Small Parts Assembly

Utilizing its 8 MP resolution and C-Mount lens flexibility, the IDS NXT malibu can provide precise visual feedback for robotic systems engaged in bin picking or intricate small parts assembly. The detailed imaging allows robots to accurately locate, identify, and manipulate components as small as 2 µm with high repeatability.

Problem Solved

Enhances automation in manufacturing by providing superior visual guidance for robots, improving pick accuracy and reducing cycle times for complex assembly tasks involving numerous small, similar components.

Robotic visionbin pickingsmall parts assemblyprecision manipulationmachine guidance